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See Lab Equipment
See Cleanroom Equipment
Lab Equipment
| Equipment | Trainers | Instructions & Data |
|---|---|---|
| Bioforce Nano eNabler nanoenabler-users@grover.mirc.gatech.edu  The Nano eNabler is a multifunctional surface patterning platform for dispensing attoliter to femtoliter volumes of biomolecules, nanoparticles and other liquids onto a wide variety of surfaces. It is faster and more flexible than conventional technologies, and has no clogging or misalignment problems, as well as multiplexing ability. | David Gottfried Paul Joseph Email Trainers | Internal Cost: $15.00/hour Industry Cost: $30.00/hour |
| FEI Nova Nanolab 200 FIB/SEM nova-users@grover.mirc.gatech.edu  The Nova Nanolab is designed to be a complete nanotechnology laboratory in one tool. It combines ultra-high resolution field emission scanning electron microscopy (SEM) and precise focused ion beam (FIB) etch and deposition. It extends your applications range for nanoscale prototyping, machining, 2D and 3D-characterization and analysis. | Joel Pikarsky Christine Kranz Kevin Martin Email Trainers | Internal Cost: $45.00/hour Industry Cost: $189.00/hour |
| FEI Quanta 200 3D FIB/SEM quanta-users@grover.mirc.gatech.edu  The Quanta 3D is designed to be a 3D-SEM. It combines traditional thermal emission Scanning Electron Microscopy (SEM) with Focused Ion Beam (FIB) to extend application ranges for 3D characterization and nanoanalysis. It allows charge-free imaging of a non-conductive specimen through its variable pressure vacuum system (ESEM) and gas chemistries for high-volume milling. Allows for: | Joel Pikarsky Christine Kranz Email Trainers | Internal Cost: $45.00/hour Industry Cost: $189.00/hour |
Kulick Dicing Saw 7100AD A dicing saw employs a high-speed spindle fitted with an extremely thin diamond blade to dice or groove semiconductor wafers and other workpieces. The dicing saw automatic performs loading, alignment, dicing, washing/drying and then reloading of the workpiece back into the cassette. | Charlie Suh Ben Hollerbach Email Trainers | |
| M-10A Semi-Automatic Flip Chip Die Bonder flipchip-users@grover.mirc.gatech.edu  The M-10 A is a versatile machine that is designed to perform high accuracy, flip chip die bonding in both prototype and limited production modes. | Joel Pikarsky Charlie Suh Email Trainers | |
| Tencor Alpha-Step Profilometer alphastep-users@grover.mirc.gatech.edu  The Alpha-Step Profilometers measures the difference in thickness across a sample and may be used to measure deposition thicknesses. | Charlie Suh Email Trainers | |
| Veeco AFM afm-users@grover.mirc.gatech.edu  The Dimension 3100 Scanning Probe Microscope (SPM) utilizes automated atomic force microscopy (AFM) and scanning tunneling microscopy (STM) techniques to measure surface characteristics for semiconductor wafers and other samples up to 200 mm in diameter. | Eric Woods Rebhadevi Jeevagan Philseok Kim Joel Pikarsky Email Trainers | AFM data Internal Cost: $15.00/hour Industry Cost: $15.00/hour |
| XPS SSX-100 xps-users@grover.mirc.gatech.edu XPS, also known as ESCA, is the most widely used surface analysis technique because of its relative simplicity in use and data interpretation. Using this machine the elemental identity, chemical state, and quantity of an element on a substrate can be determined. The information XPS provides about surface layers or thin film structures is of value in many industrial applications including: polymer surface modification, catalysis, corrosion, adhesion, semiconductor and dielectric materials, electronics packaging, magnetic media, and thin film coatings used in a number of industries | Dan Berrigan Brent Carter Email Trainers | |
| Zeiss SEM Ultra60 fesem-users@grover.mirc.gatech.edu  The Zeiss scanning electron microscope is the instrument of choice for clear and precise imaging on large delicate specimems or uncoated wafers. The ULTRA 60 enables clear topographic imaging with the high efficiency In-lens SE detector. | Joel Pikarsky Charlie Suh Email Trainers | Internal Cost: $30.00/hour Industry Cost: $30.00/hour |
Cleanroom Equipment
| Equipment | Trainers | Instructions & Data |
|---|---|---|
| AET RTP rtp-users@grover.mirc.gatech.edu  Rapid thermal processors (RTP) or rapid thermal annealers (RTA) are used to rapidly heat a sample for annealing. The RTP can heat a sample to 500 degrees C in as low as five seconds and can heat samples to 1100 degrees C in as little as 20 seconds. | Charlie Suh Celeste Mason Nicole Saint-Aubin Email Trainers | |
| ALD 1 ald1-users@grover.mirc.gatech.edu  The Atomic Layer Deposition (ALD) tool is used to deposit atomic layers of material. The ALD uses 2 precursor gases and pulses each of these with a purge in between. Each cycle of gases creates an atomic layer of material on the sample. The tool is set up to deposit Al2O3 and can take up to a 6" substrate or wafer pieces up to that area. | Jason Herrington Celeste Mason John Pham Email Trainers | |
| Astex ECR ecr-users@grover.mirc.gatech.edu  Electron Cyclotron Resonance (ECR) is a technology that produces higher density plasmas and better ion separation than a parallel plate reactor. | William Kimes Email Trainers | |
| CEE 100CB Spinner cee_spinner-users@grover.mirc.gatech.edu  Spin coaters are used to distribute photoresist in a thin uniform layer by spinning the substrate. The CEE 100CB spinners are reserved for photoresist use. Other materials must be done with the SCS spinners. Also equipped with hotplates. (Six hotplates are available throughout the cleanroom.) | Jeffrey Karle Celeste Mason Nicole Saint-Aubin Email Trainers | |
| CEE 100CB Spinner -- Left cee_spinner-users@grover.mirc.gatech.edu  | Celeste Mason Email Trainers | |
| CEE 100CB Spinner -- Right cee_spinner-users@grover.mirc.gatech.edu  | Celeste Mason Email Trainers | |
| Chemical Safety Seminar - Rm 102B safetyseminar-users@grover.mirc.gatech.edu | Charlie Suh Email Trainers | |
| CMOS Cleaning Station cmosbench-users@grover.mirc.gatech.edu  | Hang Chen William Kimes Eric Woods Email Trainers | |
| Coyote PECVD coyote-users@grover.mirc.gatech.edu  The Coyote PECVD is a tube furnace PECVD used to deposit silicon nitride. | Brian Rounsaville Ajay Upadhyaya Email Trainers | |
| CVC DC Sputterer dcsputterer-users@grover.mirc.gatech.edu  The DC sputterer is used to coat samples with metals. Metal coatings are usually performed with this sputterer or with the CVC E-Beam evaporator. | Charlie Suh Michael Cantrell Nicole Saint-Aubin Email Trainers | |
| CVC DC Sputterer 2 dcsputterer2-users@grover.mirc.gatech.edu  | Jason Herrington Email Trainers | |
| CVC E-Beam Evaporator ebeam-users@grover.mirc.gatech.edu  The e-beam evaporator is used to coat samples with various metals. Unlike sputtered films, evaporators only coat the surface facing away from the substrate. | Charlie Suh Jin Liu Nicole Saint-Aubin Email Trainers | |
| CVC E-Beam Evaporator 2 ebeam2-users@grover.mirc.gatech.edu  | Charlie Suh Nicole Saint-Aubin Erin Walters Email Trainers | |
| Dexon Fume Hood--Class 10 class10bench-users@grover.mirc.gatech.edu  A chemical fume hood is a partially enclosed work space that is exhausted to the outside. When used properly, hazardous gases and vapors generated inside the hood are captured before they enter the breathing zone. | Tran-Vinh Nguyen Email Trainers | |
Dexon Fume Hood--Class 1000 A chemical fume hood is a partially enclosed work space that is exhausted to the outside. When used properly, hazardous gases and vapors generated inside the hood are captured before they enter the breathing zone. | Tran-Vinh Nguyen tn42@mail.gatech.edu | |
Dexon Fume Hood--Dry Process A chemical fume hood is a partially enclosed work space that is exhausted to the outside. When used properly, hazardous gases and vapors generated inside the hood are captured before they enter the breathing zone. | Tran-Vinh Nguyen tn42@mail.gatech.edu | |
Dexon Fume Hood--Metalization A chemical fume hood is a partially enclosed work space that is exhausted to the outside. When used properly, hazardous gases and vapors generated inside the hood are captured before they enter the breathing zone. | Tran-Vinh Nguyen tn42@mail.gatech.edu | |
Dexon Fume Hood--Plasma Processing The cleaning station is generally used for a special cleaning process called the Piranha clean | Tran-Vinh Nguyen tn42@mail.gatech.edu | |
| Ernest Fullam SputterCoater goldcoater-users@grover.mirc.gatech.edu  This mini-sputterer is used to prepare non-conductive SEM samples by coating them with gold. | Nicole Saint-Aubin Email Trainers | |
| EV620 Mask Aligner ev620-users@grover.mirc.gatech.edu  -Configured for Top and Backside Alignment (auth) | Tran-Vinh Nguyen Jason Herrington Email Trainers | |
| Gasonics Asher asher-users@grover.mirc.gatech.edu  The Aura 1000 Asher is a microprocessor controlled downstream photoresist stripper that will strip the front and backside of a wafer, typically in less than one minute. It is also able to function as a descummer by removing approximately 200-500 angstroms of photoresist. The Asher can remove a maximum of one micron of photoresist. | Charlie Suh Assim Addous Houri Johari Celeste Mason Email Trainers | |
Heraeus Vacuum Oven 1 The Heraeus Vacuum Oven used for heating of substrates under 5-10 milliTorr Vacuum - up to 350C under vacuum. By using the Eurotherm programmer, the oven can be programmed to ramp, dwell, and cool down due to the user’s specifications. | Nicole Saint-Aubin Tran-Vinh Nguyen Email Trainers | |
| Hitachi 3500H SEM sem-users@grover.mirc.gatech.edu  The Hitachi 3500H series scanning electron microscope offers high resolution imaging in a vacuum. | Cristina Scelsi Ben Hollerbach Email Trainers | SEM pictures |
| Hummer Sputtering System hummer-users@grover.mirc.gatech.edu The Hummer Sputtering System is used to prepare non-conductive SEM samples by | Nicole Saint-Aubin Assim Addous Celeste Mason John Pham Charlie Suh Email Trainers | |
| Hysitron TriboIndenter indenter-users@grover.mirc.gatech.edu  The TriboIdenter is used to measure the hardness and elastic modulus of thin films and coatings. | Venmathy Rajarathinam Email Trainers | TriboIndenter data |
| JEOL JBX-9300FS EBL System jeolebeam-users@grover.mirc.gatech.edu  Nanolithography at Tech | Devin Brown Raghunath Murali Email Trainers | |
| Karl Suss Bonder ksbonder-users@grover.mirc.gatech.edu  The SB6 is a semiautomatic, computer controlled, stand-alone substrate bonder equipped with a vacuum/pressure chamber and a loading arm. It can be used for most substrate bond processes, with high alignment accuracy and precision. | Yuan Li David Chung Tran-Vinh Nguyen Email Trainers | |
| Karl Suss MA-6 Mask Aligner ma6-users@grover.mirc.gatech.edu  Mask aligners are used in photolithographic processes to transfer a pattern from a mask to a photoresist coating on the substrate. The MA-6 can handle wafers up to 6" in size, and is optimized for 435 nm wavelength. | Kianoush Naeli Keri Ledford Tran-Vinh Nguyen Email Trainers | |
| Karl Suss MJB-3 Mask Aligner -- Right mjb3_1-users@grover.mirc.gatech.edu  The Suss MJB3 is a highly versatile mask aligner which can handle 1mm pieces up to 3-inch wafers. | Charlie Suh Email Trainers | |
| Karl Suss RC8 Spin Coater rc8suss-users@grover.mirc.gatech.edu  The RC81 programmable process spinner is reserved for photoresist use. Spin coatings of other materials must be done with the SCS spinners. Photoresist coatings are usually performed with the CEE 100CB spin coaters. | Cristina Scelsi Celeste Mason Phillip Tyler Email Trainers | |
| Karl Suss TSA MA6 Mask Aligner tsa-ma6-users@grover.mirc.gatech.edu  Topside/Backside Alignment | Tran-Vinh Nguyen Keri Ledford Email Trainers | |
| Kulicke & Sofa Industrial Bonder kasbonder-users@grover.mirc.gatech.edu | Tran-Vinh Nguyen Email Trainers | |
| Lap Master Lapper lapper-users@grover.mirc.gatech.edu | William Galle Gary Spinner Email Trainers | |
| Lap Master Polisher polisher-users@grover.mirc.gatech.edu | William Galle Email Trainers | |
| Lindberg Furnace lindberg-users@grover.mirc.gatech.edu  The Lindberg furnaces are used for curing polymers, sintering, and growing oxides and nitrides on silicon wafers. | Paul Joseph William Kimes Email Trainers | |
| Logitech Polisher polisher_2-users@grover.mirc.gatech.edu  | William Kimes Email Trainers | |
| Mask Shop maskshop-users@grover.mirc.gatech.edu | Cristina Scelsi Phillip Tyler Email Trainers | |
| MEMS Wet Bench memsbench-users@grover.mirc.gatech.edu  | William Kimes Tran-Vinh Nguyen Email Trainers | |
| Nanospec Refractometer nanospec-users@grover.mirc.gatech.edu  The NanoSpec 3000 is a film thickness measurement system that utilizes a modern small spot spectroscopic reflectometer that is built on a simple-to-use tabletop platform. | Eric Woods Cristina Scelsi Email Trainers | Nanospec data |
| Noran EDS System eds-users@grover.mirc.gatech.edu  The Noran EDS, which is attached to the Hitachi SEM, performs elemental analysis on a sample. | Cristina Scelsi Ben Hollerbach Email Trainers | EDS data |
| OAI: Optical Associates, Inc. Mask Aligner oai-users@grover.mirc.gatech.edu  The OAI high-resolution mask alignment and exposure system is a high-performance contact mask aligner developed for ultra-precise, submicron, level-to-level alignment lithography. | Yanzhu Zhao Charlie Suh Email Trainers | |
| Obducat Nanoimprint Lithography System nil-users@grover.mirc.gatech.edu  Cooling | Muhannad Bakir Jesal Zaveri Email Trainers | |
| Olympus / C Squared Vanox Microscope vanox-users@grover.mirc.gatech.edu  The Olympus C-Squared Microscope is used for taking pictures and illuminating samples. | Tran-Vinh Nguyen Email Trainers | Microscope pictures |
| Plas-Mos Ellipsometer plasmos-users@grover.mirc.gatech.edu  The Plas-mos ellipsometer is used for measuring thicknesses of thin films such as oxides and nitrides. | Janet Cobb Charlie Suh Email Trainers | |
| Plasma Cleaner plasma_cleaner-users@grover.mirc.gatech.edu Plasma Cleaner | John Pham Cristina Scelsi Email Trainers | |
| Plasma-Therm ICP icp-users@grover.mirc.gatech.edu  An ICP (inductively coupled plasma) etcher can be used to etch a variety of materials. This ICP is equipped with two chambers -- one is dedicated to deep silicon trench etching and the other is used for silicon dioxide and polymer etching. | Kianoush Naeli Keri Ledford Phillip Tyler Eric Woods Email Trainers | |
| Plasma-Therm PECVD pecvd1-users@grover.mirc.gatech.edu  A PECVD (Plasma Enhanced Chemical Vapor Depositor) reacts gases in a RF (radio frequency) induced plasma to deposit materials such as silicon dioxide and silicon nitride. This PECVD has two chambers. | Ajay Upadhyaya Assim Addous Keri Ledford Eric Woods Email Trainers | |
| Plasma-Therm RIE rie1-users@grover.mirc.gatech.edu  RIEs (Reactive Ion Etcher) are used to etch various materials, such as silicon dioxide, silicon nitride, polymers, and various metals using reactive gases in a RF (radio frequency) reactive ion plasma. This RIE system operates at 13.56 MHz and has two chambers that are used for etching of nonmetallic materials and metals like Al respectively. | Keri Ledford Nicole Saint-Aubin Phillip Tyler Eric Woods Email Trainers | |
| Plasma-Therm SLR RIE rie2-users@grover.mirc.gatech.edu  RIEs (reactive ion etchers) are used to etch various materials, such as silicon dioxide, silicon nitride, various polymers, and various metals from the surface of a substrate using various reactive gases in a RF (radio frequency) induced plasma. | Tran-Vinh Nguyen Jason Herrington Keri Ledford Email Trainers | |
| PVD75 Filament Evaporator pvd75-users@grover.mirc.gatech.edu  The filament evaporator is used to coat samples with various metals. The PVD is a good choice for samples that need to be evaporator coated (to avoid coating the sides of rough topologies) but are sensitive to x-ray radiation from the E-beam. | Jason Herrington Celeste Mason Nicole Saint-Aubin Charlie Suh Email Trainers | |
| PVD75 RF Sputterer pvd75rf-users@grover.mirc.gatech.edu  The RF sputterer can be used to deposit many dielectrics. Coatings are performed by accelerating ions or an argon oxygen mixture into the surface of a sputter target, which is made of the material to be applied to the sample. | Charlie Suh Michael Cantrell Jason Herrington Gopal Jha Celeste Mason Eric Woods Email Trainers | |
| Samco UV Ozone Dry Stripper uvstripper-users@grover.mirc.gatech.edu  The Samco model UV-1 is a stripper/cleaner used for cleaning or stripping organic materials such as solvent residues, photoresist, ink, or polyimide from substrate materials. The system accomplishes this with a combination of UV light, ozone, and heat. | William Kimes Email Trainers | |
| Screen Printer screenprinter-users@grover.mirc.gatech.edu  This is a standalone, semi-automatic screen printer. | Charlie Suh Email Trainers | |
| SemiTest SCA-2500 Surface Charge Analyzer sca-users@grover.mirc.gatech.edu  The surface charge analyzer is used as a quality monitor for measuring surface charge on films such as silicon dioxide. | Hang Chen Eric Woods Email Trainers | |
| Semitool Spin Rinse Dryer semitool_srd-users@grover.mirc.gatech.edu  The spin-rinse-dryer is equipped for cleaning four-inch silicon wafers. It spins the wafers and uses deionized water and nitrogen to clean and dry the wafers. | Hang Chen William Kimes Email Trainers | |
| Signatone Probe Signatoneprobe-users@grover.mirc.gatech.edu  The Signatone Four Point Probe measures sheet resistivity on both blank wafers and wafers with a thin layer. The probe measures resistivity less than 1 ohm. | Nicole Saint-Aubin Eric Woods Email Trainers | |
| STS AOE stsaoe-users@grover.mirc.gatech.edu  The Advanced Oxide Etch (AOE) source is a revolutionary design, based on STS' well-established Inductively Coupled Plasma (ICP) technology. The AEO source is originally conceived to overcome the limitations of conventional high density plasma sources for SiO2 deep etch applications. Its also proven to be suitable for deep etching quartz fused silica. LiNbO3 and SiC throughout the optoelectronics and MEMS applications. | Tran-Vinh Nguyen Keri Ledford John Pham Eric Woods Email Trainers | |
| STS ICP stsicp-users@grover.mirc.gatech.edu  The STS ICP is a CMOS-compatible tool used for integrated MEMS-CMOS processes, and is meant for narrow (<10 micron in width) high aspect-ratio trench etching in Silicon and SOI wafers. At the MiRC, this system is used only for etching high aspect-ratio trenches in Silicon and SOI wafers. | Ashwin Samarao Keri Ledford Tran-Vinh Nguyen Eric Woods Email Trainers | |
| STS PECVD pecvd2-users@grover.mirc.gatech.edu  A PECVD (Plasma Enhanced Chemical Vapor Depositor) process reacts gases in a RF (radio frequency) induced plasma to deposit materials such as silicon dioxide and silicon nitride. | Keri Ledford Phillip Tyler Eric Woods Email Trainers | |
| STS SOE stssoe-users@grover.mirc.gatech.edu  STS' ICP system combines a high conductance high vacuum compatible process chamber with a patented ICP source to produce a very high ion density at low pressures. With this technology, STS ICP Standard Oxide Etcher is suitable for shallow etching (less than 15 micron trenches) of SiO2 and III-V materials that require higher etch rates, higher aspect ratios, and better selectivity compared to using conventional RIE technology. | Ehsan Shah Hosseini Keri Ledford Tran-Vinh Nguyen Email Trainers | |
| Tencor KLA Profilometer klatencor-users@grover.mirc.gatech.edu The P15 OF is a robust, programmable stylus profiler system that provides 2D and 3D topographic measurements. | Cristina Scelsi Keri Ledford Celeste Mason Eric Woods Email Trainers | |
| Tencor KLA Profilometer - FC klatencor-users@grover.mirc.gatech.edu  The P15 OF is a robust, programmable stylus profiler system that provides 2D and 3D topographic measurements. | Cristina Scelsi Celeste Mason Eric Woods Email Trainers | Profilometer data |
| Tousimis Super Critical Dryer criticaldryer-users@grover.mirc.gatech.edu  The Autosamdri 815B is an Automatic Supercritical Point Dryer that procesess 5 wafers up to 4 | David Chung Jeffrey Karle Tran-Vinh Nguyen Email Trainers | |
| Trion ICP icp_2-users@grover.mirc.gatech.edu  The Trion Phantom etcher has an Inductively Coupled Plasma (ICP) source. The ICP allows the user to create high-density plasma. The high-density plasma enables high etch rates and anisotropy. An electrostatic chuck provides increased sample cooling during the etching process. | Tran-Vinh Nguyen John Pham Email Trainers | |
| Tystar Nitride Furnace tystar_nitride-users@grover.mirc.gatech.edu  TYTAN Furnace systems can be used for all conventional atmospheric and low-pressure CVD processes employed in the semiconductor industry. A variety of advanced wafer fabrication processes are also possible, including: Thick Themal Oxides, Silicon-Germanium, etc. | William Kimes Eric Woods Email Trainers | |
| Tystar Polysilicon Furnace tystar_poly-users@grover.mirc.gatech.edu  TYTAN Furnace systems can be used for all conventional atmospheric and low-pressure CVD processes employed in the semiconductor industry. A variety of advanced wafer fabrication processes are also possible, including: Thick Themal Oxides, Silicon-Germanium, etc. | William Kimes Eric Woods Email Trainers | |
| Ultratech Plate Cleaner maskcleaner-users@grover.mirc.gatech.edu  The Ultra-Tech plate cleaner can be used to automatically clean photolithography masks. | Charlie Suh Celeste Mason Cristina Scelsi Email Trainers | |
| Unaxis PECVD pecvd3-users@grover.mirc.gatech.edu  A PECVD (Plasma Enhanced Chemical Vapor Depositor) reacts gases in a RF (radio frequency) induced plasma to deposit materials such as silicon dioxide and silicon nitride. This PECVD has one chamber. | Jaime Zahorian Keri Ledford Eric Woods Email Trainers | |
| Unifilm Sputterer unifilm-users@grover.mirc.gatech.edu  The Unifilm Multisource Sputtering System deposits thin metal films in a argon-enriched low vacuum. The Unifilm Sputterer has a deposition monitor to quickly and accurately measure Source distributions, a computer-controlled Planetary System, and a computer model of the source-planetary system. | Charlie Suh Celeste Mason Nicole Saint-Aubin Email Trainers | |
| Veeco AFM Advanced Training afm_advanced-users@grover.mirc.gatech.edu Second training class for AFM users | Eric Woods Joel Pikarsky Email Trainers | |
| Verteq Spin Rinse Dryer verteq_srd-users@grover.mirc.gatech.edu  The Verteq spin rinse dryer is a drying system that uses centrifugal forces to dry the surface of a substrate. The liquid on the substrate surface is spun off and drained from the bowl while liquid droplets on the drying chamber surfaces are evaporated. | Charlie Suh Jason Herrington Email Trainers | |
| Vision RIE - Oxide vision-oxide-users@grover.mirc.gatech.edu  The Vision 320 RIE is a manually loaded Reactive Ion Etcher plasma system. It is used to etch a variety of materials. | Jaime Zahorian Tran-Vinh Nguyen Cristina Scelsi Phillip Tyler Email Trainers | |
| Vision RIE - Oxide 2 CMOS ONLY vision-oxide-2-users@grover.mirc.gatech.edu  The Vision 320 RIE is a manually loaded Reactive Ion Etcher plasma system. It is used to etch a variety of oxides. | Eric Woods Tran-Vinh Nguyen Email Trainers | |
| Woollam Ellipsometer woollam-users@grover.mirc.gatech.edu  Determines the film thickness and optical properties of a sample. The data is obtained by measuring the change in polarization state of light that occurs when light is reflected off the surface of (or transmitted through) a sample. | Eric Woods Nathan Hull Cristina Scelsi Email Trainers | Ellipsometer data |
| Wyko Profilometer wyko-users@grover.mirc.gatech.edu  The Veeco noncontact profilometer uses the phase change of light reflecting from various heights of similar materials to measure the uniformity of a flat surface or the horizontal distance between two adjacent surfaces. | Janet Cobb-Sullivan Eric Woods Email Trainers | Profilometer data |
| Xactix xactix-users@grover.mirc.gatech.edu  | Eric Woods Jenna Fu Tran-Vinh Nguyen Email Trainers |