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See Lab Equipment
See Cleanroom Equipment
Lab Equipment
| Equipment | Trainers | Instructions & Data |
|---|---|---|
| Dage X-Ray XD7600NT dage_xray-users@grover.mirc.gatech.edu ![]() The Dage X-Ray XD7600NT provides the highest resolution and largest X-ray images for failure analysis with oblique angle views up to 70 degrees, displayed at full 2 Mpixel resolution on screen. | Rebhadevi Jeevagan Gregory Book Walter Henderson Email Trainers | Internal Cost: $20.00/hour Industry Cost: $36.00/hour |
| FEI Nova Nanolab 200 FIB/SEM nova-users@grover.mirc.gatech.edu ![]() The Nova Nanolab is designed to be a complete nanotechnology laboratory in one tool. It combines ultra-high resolution field emission scanning electron microscopy (SEM) and precise focused ion beam (FIB) etch and deposition. It extends your applications range for nanoscale prototyping, machining, 2D and 3D-characterization and analysis. | Joel Pikarsky Kevin Martin Email Trainers | Internal Cost: $45.00/hour Industry Cost: $189.00/hour |
| FEI Quanta 200 3D FIB/SEM quanta-users@grover.mirc.gatech.edu ![]() The Quanta 3D is designed to be a 3D-SEM. It combines traditional thermal emission Scanning Electron Microscopy (SEM) with Focused Ion Beam (FIB) to extend application ranges for 3D characterization and nanoanalysis. It allows charge-free imaging of a non-conductive specimen through its variable pressure vacuum system (ESEM) and gas chemistries for high-volume milling. Allows for: | Joel Pikarsky Email Trainers | Internal Cost: $45.00/hour Industry Cost: $189.00/hour |
| Hysitron TriboIndenter indenter-users@grover.mirc.gatech.edu ![]() The TriboIdenter is used to measure the hardness and elastic modulus of thin films and coatings. | Venmathy Rajarathinam Email Trainers | TriboIndenter data Internal Cost: $20.00/hour Industry Cost: $82.00/hour |
Kulick Dicing Saw 7100AD![]() A dicing saw employs a high-speed spindle fitted with an extremely thin diamond blade to dice or groove semiconductor wafers and other workpieces. The dicing saw automatic performs loading, alignment, dicing, washing/drying and then reloading of the workpiece back into the cassette. | Charlie Suh Ben Hollerbach Email Trainers | |
| Tencor Alpha-Step Profilometer alphastep-users@grover.mirc.gatech.edu ![]() The Alpha-Step Profilometers measures the difference in thickness across a sample and may be used to measure deposition thicknesses. | Eric Woods Charlie Suh Email Trainers | Internal Cost: $20.00/hour Industry Cost: $20.00/hour |
| Veeco AFM afm-users@grover.mirc.gatech.edu ![]() The Dimension 3100 Scanning Probe Microscope (SPM) utilizes automated atomic force microscopy (AFM) and scanning tunneling microscopy (STM) techniques to measure surface characteristics for semiconductor wafers and other samples up to 200 mm in diameter. | Rebhadevi Jeevagan Walter Henderson Philseok Kim Joel Pikarsky Eric Woods Email Trainers | AFM data Internal Cost: $20.00/hour Industry Cost: $35.00/hour |
| XPS SSX-100 xps-users@grover.mirc.gatech.edu XPS, also known as ESCA, is the most widely used surface analysis technique because of its relative simplicity in use and data interpretation. Using this machine the elemental identity, chemical state, and quantity of an element on a substrate can be determined. The information XPS provides about surface layers or thin film structures is of value in many industrial applications including: polymer surface modification, catalysis, corrosion, adhesion, semiconductor and dielectric materials, electronics packaging, magnetic media, and thin film coatings used in a number of industries. | Dan Berrigan Brent Carter Walter Henderson Rebhadevi Jeevagan Eric Woods Email Trainers | Internal Cost: $30.00/hour Industry Cost: $145.00/hour |
| Zeiss SEM Ultra60 fesem-users@grover.mirc.gatech.edu ![]() The Zeiss scanning electron microscope is the instrument of choice for clear and precise imaging on large delicate specimems or uncoated wafers. The ULTRA 60 enables clear topographic imaging with the high efficiency In-lens SE detector. | Joel Pikarsky Charlie Suh Email Trainers | Internal Cost: $35.00/hour Industry Cost: $103.00/hour |
Cleanroom Equipment
| Equipment | Trainers | Instructions & Data |
|---|---|---|
| AET RTP rtp-users@grover.mirc.gatech.edu ![]() Rapid thermal processors (RTP) or rapid thermal annealers (RTA) are used to rapidly heat a sample for annealing. The RTP can heat a sample to 500 degrees C in as low as five seconds and can heat samples to 1100 degrees C in as little as 20 seconds. | Charlie Suh Email Trainers | |
| ALD - Al2O3 ald1-users@grover.mirc.gatech.edu ![]() The Atomic Layer Deposition (ALD) tool is used to deposit atomic layers of material. The ALD uses 2 precursor gases and pulses each of these with a purge in between. Each cycle of gases creates an atomic layer of material on the sample. The tool is set up to deposit Al2O3 and can take up to a 6" substrate or wafer pieces up to that area. | Jason Herrington Eli Ellis Ben Hollerbach John Pham Email Trainers | |
| ALD - SrTi ald2-users@grover.mirc.gatech.edu ![]() The Atomic Layer Deposition (ALD) tool is used to deposit atomic layers of material. This ALD uses 2 or 3 precursor gases and pulses each of these with a purge in between. Each cycle of gases creates an atomic layer of material on the sample. The tool is set up to deposit SrO2, TiO2, and SrTi. It can take up to a 6" substrate or wafer pieces up to that area. | Jason Herrington Ben Hollerbach Email Trainers | |
| Astex ECR ecr-users@grover.mirc.gatech.edu ![]() Electron Cyclotron Resonance (ECR) is a technology that produces higher density plasmas and better ion separation than a parallel plate reactor. | William Kimes Email Trainers | |
| Asys Screen Printer & Vaccum Pump asys-users@grover.mirc.gatech.edu | Stephen Tyler st144@mail.gatech.edu | |
| Bioforce Nano eNabler nanoenabler-users@grover.mirc.gatech.edu The Nano eNabler is a multifunctional surface patterning platform for dispensing attoliter to femtoliter volumes of biomolecules, nanoparticles and other liquids onto a wide variety of surfaces. It is faster and more flexible than conventional technologies, and has no clogging or misalignment problems, as well as multiplexing ability. | David Gottfried Paul Joseph Email Trainers | |
| Black Magic PECVD bmpecvd-users@grover.mirc.gatech.edu | Baratunde Cola -baratunde.cola@me.gatech.edu Ben Hollerbach ben.hollerbach@nrc.gatech.edu Gary Spinner gary.spinner@mirc.gatech.edu | |
| CEE 100CB Spinner cee_spinner-users@grover.mirc.gatech.edu ![]() Spin coaters are used to distribute photoresist / polymers in a thin uniform layer by spinning the substrate. The time limit for this machine is one hour. | Assim Addous Pedro Garcia Nicole Saint-Aubin Email Trainers | |
| CHA Ebeam 2 cha-ebeam-2-users@grover.mirc.gatech.edu ![]() The e-beam evaporator will provide very little coating to the sides of any features that are perpendicular to the surface of the substrate. | Charlie Suh Kevin Bicknell Email Trainers | |
| CMOS Cleaning Station cmosbench-users@grover.mirc.gatech.edu ![]() This fume hood has heated tanks: Piranha, SC1, SC2 cleans and Nitride etch tank. These wet baths are only available for use for CMOS-qualified processes with approved process flows. | Eric Woods Pedro Garcia William Kimes Email Trainers | |
| Coyote PECVD coyote-users@grover.mirc.gatech.edu ![]() The Coyote PECVD is a tube furnace PECVD used to deposit silicon nitride. | Brian Rounsaville Ajay Upadhyaya Email Trainers | |
| CVC DC Sputterer dcsputterer-users@grover.mirc.gatech.edu ![]() The DC sputterer is used to coat samples with metals. Metal coatings are usually performed with this sputterer or with the CVC E-Beam evaporator. | Charlie Suh Steven Beardsell Nicole Saint-Aubin Email Trainers | |
| CVC E-Beam Evaporator ebeam-users@grover.mirc.gatech.edu ![]() The e-beam evaporator is used to coat samples with various metals. Unlike sputtered films, evaporators only coat the surface facing away from the substrate. | Charlie Suh Kevin Brenner Wenchao Li Gerald Lopez Chen Xu Email Trainers | |
| CVC E-Beam Evaporator 2 ebeam2-users@grover.mirc.gatech.edu ![]() The e-beam evaporator is used to coat samples with various metals. Unlike sputtered films, evaporators only coat the surface facing away from the substrate. | Charlie Suh Kevin Brenner Wenchao Li Gerald Lopez Erin Walters Chen Xu Email Trainers | |
| DCA dca-users@grover.mirc.gatech.edu The ramé-hart Model 250 goniometer is a software-driven instrument providing automated digital contact angle measurements. This instrument has been furnished with a 4” rotating wafer support stage and automated tilting base option. The Model 250 is also a tensiometer and has an advanced software version for surface energy measurements as well as surface tension and dynamic studies. Advancing and receding contact angles are readily determined by inclining the substrate and allowing the drop to deform as a function of gravity. | John Pham David Gottfried Email Trainers | |
| Dexon Fume Hood--Class 10 class10bench-users@grover.mirc.gatech.edu ![]() A chemical fume hood is a partially enclosed work space that is exhausted to the outside. When used properly, hazardous gases and vapors generated inside the hood are captured before they enter the breathing zone. | Tran-Vinh Nguyen Email Trainers | |
| EV620 Mask Aligner ev620-users@grover.mirc.gatech.edu ![]() -Configured for Top and Backside Alignment (auth) | Tran-Vinh Nguyen Jason Herrington Email Trainers | |
| Gasonics Asher asher-users@grover.mirc.gatech.edu ![]() The Aura 1000 Asher is a microprocessor controlled downstream photoresist stripper that will strip the front and backside of a wafer, typically in less than one minute. It is also able to function as a descummer by removing approximately 200-500 angstroms of photoresist. The Asher can remove a maximum of one micron of photoresist. | Charlie Suh Assim Addous Houri Johari Wenchao Li Email Trainers | |
Heraeus Vacuum Oven 1![]() The Heraeus Vacuum Oven used for heating of substrates under 5-10 milliTorr Vacuum - up to 350C under vacuum. By using the Eurotherm programmer, the oven can be programmed to ramp, dwell, and cool down due to the user's specifications. | Nicole Saint-Aubin Eli Ellis Jason Herrington Tran-Vinh Nguyen Phillip Tyler Email Trainers | |
Heraeus Vacuum Oven 2![]() The Heraeus Vacuum Oven used for heating of substrates under 5-10 milliTorr Vacuum - up to 350C under vacuum. By using the Eurotherm programmer, the oven can be programmed to ramp, dwell, and cool down due to the user's specifications. | Nicole Saint-Aubin Tran-Vinh Nguyen Phillip Tyler Email Trainers | |
| Hitachi 3500H SEM sem-users@grover.mirc.gatech.edu ![]() The Hitachi 3500H series scanning electron microscope offers high resolution imaging in a vacuum. | Ben Hollerbach Kevin Brenner Charlie Suh Email Trainers | SEM pictures |
| Hummer Sputtering System hummer-users@grover.mirc.gatech.edu ![]() The Hummer Sputtering System is used to prepare non-conductive SEM samples by | Nicole Saint-Aubin Assim Addous Ben Hollerbach John Pham Charlie Suh Email Trainers | |
| IR/HMDS Oven ir_hmds_oven-users@grover.mirc.gatech.edu ![]() The image reversal oven exposes the pattern on the resist to ammonia vapor, reversing the pattern on the mask material (e.g. certain photoresists). The oven converts to a HMDS vapor priming oven when the gas is switched between HMDS vapor and Ammonia (NH3). The temperature control is adjustable. | John Pham Email Trainers | |
| JEOL JBX-9300FS EBL System jeolebeam-users@grover.mirc.gatech.edu ![]() Nanolithography at Tech | Devin Brown Nicole Devlin Raghunath Murali Email Trainers | |
| Jet Lab II jetlab-users@grover.mirc.gatech.edu This table-top ink-jet microdispensing and printing platform is useful for a wide variety of applications. Typical “inks” include liquid solder, adhesives, polymers, and biological materials, including diagnostic reagents, proteins, and DNA. As a non-contact printing process, the accuracy of ink-jet dispensing is not affected by how the fluid wets a substrate, and the fluid source cannot be contaminated by materials on the substrate. In addition, the ability to free-fly fluid droplets allows the fluid to be dispensed into and onto non-planar and complex structural features. | John Pham David Gottfried Email Trainers | |
| Karl Suss Bonder ksbonder-users@grover.mirc.gatech.edu ![]() The SB6 is a semiautomatic, computer controlled, stand-alone substrate bonder equipped with a vacuum/pressure chamber and a loading arm. It can be used for most substrate bond processes, with high alignment accuracy and precision. | Yuan Li David Chung Tran-Vinh Nguyen Email Trainers | |
| Karl Suss MA-6 Mask Aligner ma6-users@grover.mirc.gatech.edu ![]() Mask aligners are used in photolithographic processes to transfer a pattern from a mask to a photoresist coating on the substrate. The MA-6 can handle wafers up to 6" in size, and is optimized for 435 nm wavelength. | Kianoush Naeli Luke Beardslee Yu-Chun Chen Xin Gao Tran-Vinh Nguyen Email Trainers | |
| Karl Suss RC8 Spin Coater rc8suss-users@grover.mirc.gatech.edu ![]() The RC81 programmable process spinner is reserved for photoresist use. Spin coatings of other materials must be done with the SCS spinners. Photoresist coatings are usually performed with the CEE 100CB spin coaters. | Eric Woods Assim Addous Phillip Tyler Email Trainers | |
| Karl Suss TSA MA6 Mask Aligner tsa-ma6-users@grover.mirc.gatech.edu ![]() Topside/Backside Alignment | Yu-Chun Chen Tran-Vinh Nguyen Email Trainers | |
| Kulicke & Sofa Industrial Bonder kasbonder-users@grover.mirc.gatech.edu | Tran-Vinh Nguyen Email Trainers | |
| Lap Master Lapper lapper-users@grover.mirc.gatech.edu | William Galle Michael Moseley Gary Spinner Email Trainers | |
| Lap Master Polisher polisher-users@grover.mirc.gatech.edu | William Galle Michael Moseley Email Trainers | |
| Lindberg Furnace lindberg-users@grover.mirc.gatech.edu ![]() The Lindberg furnaces are used for curing polymers, sintering, and growing oxides and nitrides on silicon wafers. | William Kimes Pedro Garcia Paul Joseph Email Trainers | |
| Logitech LP50 | Pedro Garcia pgarcia6@mail.gatech.edu | |
| Logitech PM5 | Pedro Garcia pgarcia6@mail.gatech.edu | |
| Logitech Polisher polisher_2-users@grover.mirc.gatech.edu ![]() | William Kimes Email Trainers | |
| MEMS Wet Bench memsbench-users@grover.mirc.gatech.edu ![]() | William Kimes Tran-Vinh Nguyen Eric Woods Email Trainers | |
| Nanospec Refractometer nanospec-users@grover.mirc.gatech.edu ![]() The NanoSpec 3000 is a film thickness measurement system that utilizes a modern small spot spectroscopic reflectometer that is built on a simple-to-use tabletop platform. | Eric Woods Amir Hossein Atabaki Email Trainers | Nanospec data |
| Noran EDS System eds-users@grover.mirc.gatech.edu ![]() The Noran EDS, which is attached to the Hitachi SEM, performs elemental analysis on a sample. | Ben Hollerbach Kevin Bicknell Email Trainers | EDS data |
| OAI: Optical Associates, Inc. Mask Aligner oai-users@grover.mirc.gatech.edu ![]() The OAI high-resolution mask alignment and exposure system is a high-performance contact mask aligner developed for ultra-precise, submicron, level-to-level alignment lithography. | Yanzhu Zhao Charlie Suh Email Trainers | |
| Obducat Nanoimprint Lithography System nil-users@grover.mirc.gatech.edu ![]() Cooling | Muhannad Bakir Jesal Zaveri Email Trainers | |
| Olympus / C Squared Vanox Microscope vanox-users@grover.mirc.gatech.edu ![]() The Olympus C-Squared Microscope is used for taking pictures and illuminating samples. | Tran-Vinh Nguyen Email Trainers | Microscope pictures |
| Parylene Labcoater scspds-users@grover.mirc.gatech.edu ![]() The Labcoter PDS 2010 is a vacuum system used for vapor deposition of Parylene. The deposition happens at room temperature in vacuum. Parylene will stick to any surface at temperatures below 80C and is difficult to remove. | Jaime Zahorian John Pham Eric Woods Email Trainers | |
| Plas-Mos Ellipsometer plasmos-users@grover.mirc.gatech.edu ![]() The Plas-mos ellipsometer is used for measuring thicknesses of thin films such as oxides and nitrides. | Janet Cobb Charlie Suh Email Trainers | |
| Plasma Cleaner plasma_cleaner-users@grover.mirc.gatech.edu The Plasma Cleaner uses an active ionized gas (plasma) in a low pressure environment to descum and remove residual organics from samples. | John Pham Email Trainers | |
| Plasma-Therm ICP icp-users@grover.mirc.gatech.edu ![]() An ICP (inductively coupled plasma) etcher can be used to etch a variety of materials. This ICP is equipped with two chambers -- one is dedicated to deep silicon trench etching and the other is used for silicon dioxide and polymer etching. | Kianoush Naeli Murtaza Askari Eric Woods Email Trainers | |
| Plasma-Therm PECVD pecvd1-users@grover.mirc.gatech.edu ![]() A PECVD (Plasma Enhanced Chemical Vapor Depositor) reacts gases in a RF (radio frequency) induced plasma to deposit materials such as silicon dioxide and silicon nitride. This PECVD has two chambers. | Assim Addous Nicole Saint-Aubin Charlie Suh Mikkel Thomas Ajay Upadhyaya Eric Woods Email Trainers | |
| Plasma-Therm RIE rie1-users@grover.mirc.gatech.edu ![]() RIEs (Reactive Ion Etcher) are used to etch various materials, such as silicon dioxide, silicon nitride, polymers, and various metals using reactive gases in a RF (radio frequency) reactive ion plasma. This RIE system operates at 13.56 MHz and has two chambers that are used for etching of nonmetallic materials and metals like Al respectively. | Assim Addous Nicole Saint-Aubin Ashwin Samarao Mikkel Thomas Email Trainers | |
| Plasma-Therm SLR RIE rie2-users@grover.mirc.gatech.edu ![]() RIEs (reactive ion etchers) are used to etch various materials, such as silicon dioxide, silicon nitride, various polymers, and various metals from the surface of a substrate using various reactive gases in a RF (radio frequency) induced plasma. | Mikkel Thomas Tran-Vinh Nguyen Email Trainers | |
| PVD75 Filament Evaporator pvd75-users@grover.mirc.gatech.edu ![]() The filament evaporator is used to coat samples with various metals. The PVD is a good choice for samples that need to be evaporator coated (to avoid coating the sides of rough topologies) but are sensitive to x-ray radiation from the E-beam. | Jason Herrington Eli Ellis Nicole Saint-Aubin Charlie Suh Email Trainers | |
| PVD75 RF Sputterer pvd75rf-users@grover.mirc.gatech.edu ![]() The RF sputterer can be used to deposit many dielectrics. Coatings are performed by accelerating ions or an argon oxygen mixture into the surface of a sputter target, which is made of the material to be applied to the sample. | Charlie Suh Steven Beardsell Matt Clemmer Eli Ellis Jason Herrington Eric Woods Email Trainers | |
| Qsense qsense-users@grover.mirc.gatech.edu The Q-Sense E4 Quartz Crystal Microbalance with Dissipation (QCM-D) is a four module instrument used to measure bulk-surface interactions for materials, chemistry, and life sciences research. A wide range of crystal surfaces are available for flexible immobilization of proteins, nucleotides, cells, and polymers. The provided modeling and analysis software enables quantification of viscosity, elasticity, and thickness of any soft film, while reaction kinetics can be extracted as well. | John Pham David Gottfried Email Trainers | |
| Samco UV Ozone Dry Stripper uvstripper-users@grover.mirc.gatech.edu ![]() The Samco model UV-1 is a stripper/cleaner used for cleaning or stripping organic materials such as solvent residues, photoresist, ink, or polyimide from substrate materials. The system accomplishes this with a combination of UV light, ozone, and heat. | Eric Woods William Kimes Email Trainers | |
| Screen Printer screenprinter-users@grover.mirc.gatech.edu ![]() This is a standalone, semi-automatic screen printer. | Charlie Suh Email Trainers | |
| SemiTest SCA-2500 Surface Charge Analyzer sca-users@grover.mirc.gatech.edu ![]() The surface charge analyzer is used as a quality monitor for measuring surface charge on films such as silicon dioxide. | Moon Hee Kang Eric Woods Email Trainers | |
| Semitool Spin Rinse Dryer semitool_srd-users@grover.mirc.gatech.edu ![]() The spin-rinse-dryer is equipped for cleaning four-inch silicon wafers. It spins the wafers and uses deionized water and nitrogen to clean and dry the wafers. | Hang Chen William Kimes Email Trainers | |
| Signatone Probe Signatoneprobe-users@grover.mirc.gatech.edu ![]() The Signatone Four Point Probe measures sheet resistivity on both blank wafers and wafers with a thin layer. The probe measures resistivity less than 1 ohm. | Nicole Saint-Aubin Eric Woods Email Trainers | |
| STS AOE stsaoe-users@grover.mirc.gatech.edu ![]() The Advanced Oxide Etch (AOE) source is a revolutionary design, based on STS' well-established Inductively Coupled Plasma (ICP) technology. The AEO source is originally conceived to overcome the limitations of conventional high density plasma sources for SiO2 deep etch applications. Its also proven to be suitable for deep etching quartz fused silica. LiNbO3 and SiC throughout the optoelectronics and MEMS applications. | Tran-Vinh Nguyen John Pham Eric Woods Email Trainers | |
| STS ICP stsicp-users@grover.mirc.gatech.edu ![]() The STS ICP is a CMOS-compatible tool used for integrated MEMS-CMOS processes, and is meant for narrow (<10 micron in width) high aspect-ratio trench etching in Silicon and SOI wafers. At the MiRC, this system is used only for etching high aspect-ratio trenches in Silicon and SOI wafers. | Ashwin Samarao Tran-Vinh Nguyen Eric Woods Hyung Suk Yang Email Trainers | |
| STS PECVD pecvd2-users@grover.mirc.gatech.edu ![]() A PECVD (Plasma Enhanced Chemical Vapor Depositor) process reacts gases in a RF (radio frequency) induced plasma to deposit materials such as silicon dioxide and silicon nitride. | John Pham Phillip Tyler Eric Woods Email Trainers | |
| STS SOE stssoe-users@grover.mirc.gatech.edu ![]() STS' ICP system combines a high conductance high vacuum compatible process chamber with a patented ICP source to produce a very high ion density at low pressures. With this technology, STS ICP Standard Oxide Etcher is suitable for shallow etching (less than 15 micron trenches) of SiO2 and III-V materials that require higher etch rates, higher aspect ratios, and better selectivity compared to using conventional RIE technology. | Ehsan Shah Hosseini Tran-Vinh Nguyen Email Trainers | |
| Tencor KLA Profilometer klatencor-users@grover.mirc.gatech.edu The P15 OF is a robust, programmable stylus profiler system that provides 2D and 3D topographic measurements. | Eric Woods Nicholas Ginga Erin Walters Email Trainers | |
| Tencor KLA Profilometer - FC klatencor-users@grover.mirc.gatech.edu ![]() The P15 OF is a robust, programmable stylus profiler system that provides 2D and 3D topographic measurements. | Eric Woods Nicholas Ginga Erin Walters Email Trainers | Profilometer data |
| Tousimis Super Critical Dryer criticaldryer-users@grover.mirc.gatech.edu ![]() The Autosamdri 815B is an Automatic Supercritical Point Dryer that procesess 5 wafers up to 4 | David Chung Tran-Vinh Nguyen Email Trainers | |
| Trion ICP icp_2-users@grover.mirc.gatech.edu ![]() The Trion Phantom etcher has an Inductively Coupled Plasma (ICP) source. The ICP allows the user to create high-density plasma. The high-density plasma enables high etch rates and anisotropy. An electrostatic chuck provides increased sample cooling during the etching process. | Tran-Vinh Nguyen John Pham Email Trainers | |
| Tystar Nitride Furnace tystar_nitride-users@grover.mirc.gatech.edu ![]() TYTAN Furnace systems can be used for all conventional atmospheric and low-pressure CVD processes employed in the semiconductor industry. A variety of advanced wafer fabrication processes are also possible, including: Thick Themal Oxides, Silicon-Germanium, etc. | William Kimes Ashwin Samarao Eric Woods Email Trainers | |
| Tystar Nitride Furnace 1 tystar_nitride1-users@grover.mirc.gatech.edu ![]() The Tystar Nitride Furnace 1 is used for N-type doping, Polysilicon doping (N-type) | Eric Woods Pedro Garcia Email Trainers | |
| Tystar Nitride Furnace 2 tystar_nitride2-users@grover.mirc.gatech.edu ![]() The Tystar Nitride Furnace 2 is used for P-type doping. | Eric Woods Pedro Garcia Email Trainers | |
| Tystar Nitride Furnace 3 tystar_nitride3-users@grover.mirc.gatech.edu ![]() The Tystar Nitride Furnace 3 is used for Padox, Well, Field (LOCOS) oxide growth. | Eric Woods Pedro Garcia Email Trainers | |
| Tystar Nitride Furnace 4 tystar_nitride4-users@grover.mirc.gatech.edu ![]() The Tystar Nitride Furnace 4 is used for LPCVD silicon nitride. | Eric Woods Pedro Garcia Email Trainers | |
| Tystar Poly Furnace 1 tystar_poly1-users@grover.mirc.gatech.edu ![]() The Tystar Poly Furnace 1 is used for LTO/implantation anneal. | Eric Woods Pedro Garcia Email Trainers | |
| Tystar Poly Furnace 2 tystar_poly2-users@grover.mirc.gatech.edu ![]() The Tystar Poly Furnace 2 is used for Kooi, P-well drive, and dry oxidation. | Eric Woods Pedro Garcia Email Trainers | |
| Tystar Poly Furnace 3 tystar_poly3-users@grover.mirc.gatech.edu ![]() The Tystar Poly Furnace 3 is used for gate oxide growth. | Eric Woods Pedro Garcia Email Trainers | |
| Tystar Poly Furnace 4 tystar_poly4-users@grover.mirc.gatech.edu ![]() The Tystar Poly Furnace 4 is used for polysilicon deposition. | Eric Woods Pedro Garcia Email Trainers | |
| Tystar Polysilicon Furnace tystar_poly-users@grover.mirc.gatech.edu ![]() TYTAN Furnace systems can be used for all conventional atmospheric and low-pressure CVD processes employed in the semiconductor industry. A variety of advanced wafer fabrication processes are also possible, including: Thick Themal Oxides, Silicon-Germanium, etc. | William Kimes Ashwin Samarao Eric Woods Email Trainers | |
| Ultratech Plate Cleaner maskcleaner-users@grover.mirc.gatech.edu ![]() The Ultra-Tech plate cleaner can be used to automatically clean photolithography masks. | Charlie Suh Email Trainers | |
| Unaxis PECVD pecvd3-users@grover.mirc.gatech.edu ![]() A PECVD (Plasma Enhanced Chemical Vapor Depositor) reacts gases in a RF (radio frequency) induced plasma to deposit materials such as silicon dioxide and silicon nitride. This PECVD has one chamber. | Jaime Zahorian Luke Beardslee Charlie Suh Eric Woods Email Trainers | |
| Unifilm Sputterer unifilm-users@grover.mirc.gatech.edu ![]() The Unifilm Multisource Sputtering System deposits thin metal films in a argon-enriched low vacuum. The Unifilm Sputterer has a deposition monitor to quickly and accurately measure Source distributions, a computer-controlled Planetary System, and a computer model of the source-planetary system. | Charlie Suh Kevin Bicknell Nicole Saint-Aubin Email Trainers | |
| Verteq Spin Rinse Dryer verteq_srd-users@grover.mirc.gatech.edu ![]() The Verteq spin rinse dryer is a drying system that uses centrifugal forces to dry the surface of a substrate. The liquid on the substrate surface is spun off and drained from the bowl while liquid droplets on the drying chamber surfaces are evaporated. | Charlie Suh Jason Herrington Email Trainers | |
| Vision RIE - Oxide vision-oxide-users@grover.mirc.gatech.edu ![]() The Vision 320 RIE is a manually loaded Reactive Ion Etcher plasma system. It is used to etch a variety of materials. | Jaime Zahorian Tran-Vinh Nguyen Roozbeh Tabrizian Phillip Tyler Email Trainers | |
| Vision RIE - Oxide 2 CMOS ONLY vision-oxide-2-users@grover.mirc.gatech.edu ![]() The Vision 320 RIE is a manually loaded Reactive Ion Etcher plasma system. It is used to etch a variety of oxides. | Jaime Zahorian Tran-Vinh Nguyen Roozbeh Tabrizian Eric Woods Email Trainers | |
| Woollam Ellipsometer woollam-users@grover.mirc.gatech.edu ![]() Determines the film thickness and optical properties of a sample. The data is obtained by measuring the change in polarization state of light that occurs when light is reflected off the surface of (or transmitted through) a sample. | Eric Woods Janet Cobb-Sullivan Email Trainers | Ellipsometer data |
| Wyko Profilometer wyko-users@grover.mirc.gatech.edu ![]() The Veeco noncontact profilometer uses the phase change of light reflecting from various heights of similar materials to measure the uniformity of a flat surface or the horizontal distance between two adjacent surfaces. | James Merrill Janet Cobb-Sullivan John Pham Eric Woods Email Trainers | Profilometer data |
| Wyko Profilometer RM161 | Nicholas Ginga nick.ginga@gatech.edu Janet Cobb-Sullivan janet.cobb-sullivan@gtri.gatech.edu John Pham johnpham@gatech.edu | |
| Xactix Xenon Difluoride Etcher xactix-users@grover.mirc.gatech.edu ![]() This tool uses xenon difluoride gas sent through a showerhead to isotropically dry etch silicon, germanium, and molybdenum. It can process pieces up to 4" wafers and generates relatively rough isotropically etched features. | Eric Woods Jenna Fu Tran-Vinh Nguyen Email Trainers | |
| XRF XRF-users@grover.mirc.gatech.edu | Hang Chen hc64@mail.gatech.edu |

















































































