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Equipment log for the Karl Suss Bonder
| 2009-6-12 | It was found that a user had placed a large block with their sample on top of it on the fixture for the KS SB6e Bonder tool; the fixture was then sent into the chamber. This block caused significant damage to the machine as the the head could not come down properly. Fortunately, the damage was repairable and the tool is now operational after significant effort.
It is *AGAINST CLEANROOM POLICY* to put any sample taller than 2 wafers on top of each other in this tool. If you have a desire to do so, you *MUST* get permission from Vinh, Eric, or Gary before doing so - in writing.
Thank you for your assistance in this matter. |
| 2009-6-11 | Sample stuck in chamber. Please watch for updates. Also, make *sure* that your sample does not have sticky material exposed to the top & bottom plates. |
| 2009-5-27 | There is currently a sample that has become attached to the top plate of the machine. The staff need to remove it. An email will be sent out once the sample has been removed.
Please remember to properly prepare / cure your samples before bonding else this may be the result. |
| 2006-9-21 | The tool has been reset, and it's ready to use. Call staff immediately if
there are any problems. No user is authorized to initialize the tool
without staff permission. |
| 2005-9-29 | The E2 Electrode has been repaired on thge
substrate bonder. We will be running test
runs on ti tomorrow. |
| 2005-9-28 | There is some internal damage to the
system that is being repaired. Please
remember to follow the proper procedure
when using the system. |
| 2005-9-27 | The bonder is currently logged down. We
are performing some maintenance on the
top heater plate. |
| 2005-10-8 | The ceramic wheels inside the bonder were
damaged on Friday. The wheels should be
repaired on Monday, and we will continue to
perform out test runs on the system. |
| 2004-11-9 | Currently, users may not control the pump down mechanism for this system.
If your recipe specifies a certain limit on the vacuum pressure, then you
will need to remove the limit in order for the system to run properly. |
| 2004-11-8 | The Bonding machine is now back up. We have removed the broken wafer and
cleaned up the chamber. If you have any further issues with this system,
please contact Vinnie. |
| 2004-11-4 | A cleanroom user reported a broken wafer inside the Bonder. Tomorrow, we
will remove the wafer and clean up the chamber. Until then, the bonding
machine will not be available. |
| 2004-10-26 | We have received and installed the sensors. After running some test
runs, we have determined that the system is functioning properly. Please
contact Vinnie if you have any questions or concerns about this machine. |