The Quanta 3D is designed to be a 3D-SEM. It combines traditional thermal emission Scanning Electron Microscopy (SEM) with Focused Ion Beam (FIB) to extend application ranges for 3D characterization and nanoanalysis. It allows charge-free imaging of a non-conductive specimen through its variable pressure vacuum system (ESEM) and gas chemistries for high-volume milling. Allows for:
-Crack tip 3D reconstruction
-Revealing sub-surface cause of surface defects on finished metal surfaces
-Characterization of strained materials along orthogonal sections
-Resolution of 3.5nm @ 30kV @ high vacuum
-5 axis motorized stage
-379 mm wide chamber
Click here for more information on the Quanta 200 3D

The Alpha-Step Profilometers measures the difference in thickness across a sample and may be used to measure deposition thicknesses.

XPS, also known as ESCA, is the most widely used surface analysis technique because of its relative simplicity in use and data interpretation. Using this machine the elemental identity, chemical state, and quantity of an element on a substrate can be determined. The information XPS provides about surface layers or thin film structures is of value in many industrial applications including: polymer surface modification, catalysis, corrosion, adhesion, semiconductor and dielectric materials, electronics packaging, magnetic media, and thin film coatings used in a number of industries.
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