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= Text Instructions
= Video Instructions
| Equipment | Trainers | Instructions & Data |
|---|---|---|
| Bioforce Nano eNabler nanoenabler-users@grover.mirc.gatech.edu  The Nano eNabler is a multifunctional surface patterning platform for dispensing attoliter to femtoliter volumes of biomolecules, nanoparticles and other liquids onto a wide variety of surfaces. It is faster and more flexible than conventional technologies, and has no clogging or misalignment problems, as well as multiplexing ability. | David Gottfried Paul Joseph Email Trainers | |
| FEI Nova Nanolab 200 FIB/SEM nova-users@grover.mirc.gatech.edu  The Nova Nanolab is designed to be a complete nanotechnology laboratory in one tool. It combines ultra-high resolution field emission scanning electron microscopy (SEM) and precise focused ion beam (FIB) etch and deposition. It extends your applications range for nanoscale prototyping, machining, 2D and 3D-characterization and analysis. | Joel Pikarsky Christine Kranz Kevin Martin Email Trainers | |
| FEI Quanta 200 3D FIB/SEM quanta-users@grover.mirc.gatech.edu  The Quanta 3D is designed to be a 3D-SEM. It combines traditional thermal emission Scanning Electron Microscopy (SEM) with Focused Ion Beam (FIB) to extend application ranges for 3D characterization and nanoanalysis. It allows charge-free imaging of a non-conductive specimen through its variable pressure vacuum system (ESEM) and gas chemistries for high-volume milling. Allows for: | Joel Pikarsky Christine Kranz Email Trainers | |
Kulick Dicing Saw 7100AD A dicing saw employs a high-speed spindle fitted with an extremely thin diamond blade to dice or groove semiconductor wafers and other workpieces. The dicing saw automatic performs loading, alignment, dicing, washing/drying and then reloading of the workpiece back into the cassette. | Charlie Suh Ben Hollerbach Email Trainers | |
| M-10A Semi-Automatic Flip Chip Die Bonder flipchip-users@grover.mirc.gatech.edu  The M-10 A is a versatile machine that is designed to perform high accuracy, flip chip die bonding in both prototype and limited production modes. | Joel Pikarsky Charlie Suh Email Trainers | |
| Tencor Alpha-Step Profilometer alphastep-users@grover.mirc.gatech.edu  The Alpha-Step Profilometers measures the difference in thickness across a sample and may be used to measure deposition thicknesses. | Charlie Suh Email Trainers |
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| Veeco AFM afm-users@grover.mirc.gatech.edu  The Dimension 3100 Scanning Probe Microscope (SPM) utilizes automated atomic force microscopy (AFM) and scanning tunneling microscopy (STM) techniques to measure surface characteristics for semiconductor wafers and other samples up to 200 mm in diameter. | Eric Woods Rebhadevi Jeevagan Philseok Kim Joel Pikarsky Email Trainers | AFM data |
| XPS SSX-100 xps-users@grover.mirc.gatech.edu XPS, also known as ESCA, is the most widely used surface analysis technique because of its relative simplicity in use and data interpretation. Using this machine the elemental identity, chemical state, and quantity of an element on a substrate can be determined. The information XPS provides about surface layers or thin film structures is of value in many industrial applications including: polymer surface modification, catalysis, corrosion, adhesion, semiconductor and dielectric materials, electronics packaging, magnetic media, and thin film coatings used in a number of industries | Dan Berrigan Brent Carter Email Trainers | |
| Zeiss SEM Ultra60 fesem-users@grover.mirc.gatech.edu  The Zeiss scanning electron microscope is the instrument of choice for clear and precise imaging on large delicate specimems or uncoated wafers. The ULTRA 60 enables clear topographic imaging with the high efficiency In-lens SE detector. | Joel Pikarsky Charlie Suh Email Trainers | |