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Karl Suss Bonder

Applications:

The Karl Suss SB6 substrate bonder is the ideal complement to the bond aligner BA6 and universal tool for bonding process for micro electro mechanical system application such as:

Anodic bonding
Silicon fusion bonding
Adhesive bonding

Features:

Wafer and substrate size between 100mm/ 4in. and 150mm/ 6in.
Higher yield using the local cleanroom concept.
Vacuum down to 5x10E-5mbar, pressure up to 2bar for 150mm/ 6in. wafers
Bonding in controlled environment.
Flexible process control using Windows NT with data recording and analysis.
Optimized bonding process can be replicated.

Configuration:

The Karl Suss SB6 includes the following components:
Basic machine with pneumaic machine control and PC.
A loading slide to hold the substrate transport fixture for secured loading process. The loading gate lid is kept small, thus contamination in the chamber is reduced to a minimum.
A process chamber with integrated handling system for shift-free transfer of the susbtrate stack.

Operating Instructions:

Go to the computer monitor: if the operator station screen doesn't pop up, click on the SB6 icon. It will open the operator station and you need to login. It then will ask you to enter user name and password. Then type the following user name and password: AA and AA.
Go to Control Center. Click on Download Recipe, the window folder will pop up. If you already have a recipe, choose your recipe from the recipe list that is stored in the computer's hard drive. If you do not have one, then see Recipe section for more information.
After choosing the recipe, the recipe's name will appear in the box. Click on Status icon, at the bottom of the box, click on Show (the machine automatically choosing Hide). Another window will pop up, from the top of that window, you choose Recipe (the last one on the right hand side). The machine will show every aspect in each step of your recipe on the screen.
Back to Control Center, click Load in the Control Center box or you can push the Load/Unload button on the control board (there is a row of 3 big white buttons label Load/Unload, Move, and Finish. Whenever the machine is ready, the light in each button will be on and you can easily see it). The loading door on the right hand side of the chamber will open. Slide the fixture slowly inside the chamber (at this point, your sample should be ready to process and placed on the fixture). Make sure it goes all the way in (you should feel a resistant force before it hits the chamber's wall).
Click on Move or push Move button, the machine will raise the fixture up to touch the top part of the chamber. It will tell you to slide the loading slide out of the chamber on the screen. Now you can again slowly slide it out. After that click Finish or push Finish button. The loading door will close. (Make sure the loading slide is completely out of the chamber, so the door won't hit it).
Go back to Control Center click Start to run your bonding process. Now go to Status window to check every step in your recipe is processed.
When all the steps of your process are done, you must wait until the machine tells you that it's ready to unload. For safety reason you should check the pressure on the Status box to make sure the pressure inside the chamber is between 950mbar and 1100mbar even though the machine is ready to unload. If you run unloading process with the pressure inside the chamber not within the pressure range you will damage the door and the chamber's seal. Also, remember that the machine won't let you unload until the temperature of the top and bottom heater is at 200 degree C.
After clicking Unload or push Unload button, the door will open and the machine will tell you to slide in the loading slide. Make sure it goes all the way in as you loading it. Then click on Move or push Move button. Now the machine will bring the fixture down and rest it on the loading slide. It then tells you to slide out the loading slide. Slide it out without touching it because it's very hot.
Then click on Finish or push on Finish button to close the chamber's door. Now go to the monitor and Log out the main control window. Wait for your sample to cool down to room temperature before you get it of the wafer chuck.