Questions, comments, complaints, bugs about this page? We would like to hear from you.
CEE 100CB Spinner Script
Introduction
The CEE 100CB spin coaters are used to distribute a thin, uniform layer of photoresist over the substrate of silicon wafers. Photoresist is evenly dispersed over the substrate by spinning wafers at speeds up to 6,000 RPM. The units are capable of spinning within 5 RPM of the set speed, which can be accurately adjusted using the keypad. The range of wafer sizes that can be spun on the CEE spin coater can be as small as ½” and as large as 8”.
The CEE 100CB spin coaters are also equipped with hotplates, which are used for curing photoresist. The hotplates are capable of reaching a maximum temperature of 300°C, and are outfitted with a vacuum feature which enables improved thermal contact between the substrate and the heating surface.
Let's now introduce our lab users.
Spinner: Programming
To begin programming the CEE spin coater you must first press the Option button, and then press the Prog button. The display on the controller should read Prog Mode/Prog#? . At this point you should enter the program number you wish to edit.
The display should then read Pg/1 Vel/0 . The 1 refers to the program number, and the 0 refers to the set point number. You should now enter the final RPM speed for the set point number and then press Enter . The display should then read Pg/1 RMP/0 . The 0 refers to the ramp rate. At this point you should enter the desired ramp rate for the final spin speed, and then press Enter . The display should then read Pg/1 Time/0 . At this point you should enter the spin time, which includes the ramp and final spin time, and then press enter. You can continue to program set points for multiple sample runs.
Spinner: Running a Program
Once the desired program has been set, press the Run button. The display should then read Prog# . Enter the program number and then press Enter . The display should then read Ready-Press Start . At this point you should load your wafer onto the spin chuck and then press Start . The unit should then begin to spin the wafer to test if it is properly centered on the chuck. If there is an inadequate amount of vacuum between the wafer and the chuck, the chuck will not spin. At this point you should visually check the centering of the wafer, and manually adjust it if it is not accurately centered. The display should read 0 to retest/Start . If further centering is necessary, adjust the wafer and then press 0 . If the wafer is properly centered, you should dispense the photoresist directly onto the wafer and press the Start button. Once the program has been completed, the alarm will ring. The alarm will continue to ring until the wafer is removed from the spin chuck and the vacuum is released. If you have set the unit to run multiple programs, it should be ready for the second sample at this point in time. The display should read Ready-Press Start .
Hotplate: Programming
To begin programming the hotplate you must first press the Prog button. The display should then read Prog Mode/Prog#? . You should then enter the program number you wish to edit. The display should then read Temp . Enter the desired temperature and then press enter. There are three different modes that can be used on the hotplate. Proximity heating uses air pressure to suspend the substrate above the hotplate. Contact heating occurs when the substrate is in direct contact with the heating surface. Vacuum heating occurs when the substrate is under vacuum and in direct contact with the heating surface.
The display should read Method 1_ Time 1 M_S_ . At this point you select the heating mode and then press ENTER . Once you have done this you should enter the desired run time for your preferred method, and then press ENTER .
Hotplate: Running a Program
To begin running the hotplate program, press the Run button. The display will then read Prog# . Enter the appropriate program number and then press enter. The display should then read Setting Temperature . Once the set point is achieved the display should read Ready- Press Start . At this point you should load your wafer on to the hotplate and then press the Start button. Once the program is complete a short alarm will sound. You should remove your sample at this point.